polyimides are widely used in the mems and flexible electronics fields due to their combined physicochemical properties, including high thermal stability, mechanical strength, and chemical resistance values. in the past decade, rapid progress has been made in the microfabrication of polyimides. however, enabling technologies, such as laser-induced graphene on polyimide, photosensitive polyimide micropatterning, and 3d polyimide microstructure assembly, have not been reviewed from the perspective of polyimide microfabrication. the aims of this review are to systematically discuss polyimide microfabrication techniques, which cover film formation, material conversion, micropatterning, 3d microfabrication, and their applications. with an emphasis on polyimide-based flexible mems devices, we discuss the remaining technological challenges in polyimide fabrication and possible technological innovations in this field.
a thermosetting polyimide, the meldin® 7000 material series exhibits extremely high dimensional stability at elevated temperatures. find polymide solutions today
open access peer-reviewed chapter
advanced materials clear / colorless polyimides nexolve’s core polymer technology is clear and colorless polyimides. nexolve specializes in three varieties of colorless polyimides that can be tailored to meet demanding applications in display applications, space structures, thermal insulation, electrical insulators, industrial tapes, and advanced composites. cp1 polyimide cp1 provides superior physical and electrical properties over […]
we examine the myths surrounding polyimide tubing and discuss its advantages for medical applications, especially minimally invasive surgical devices.
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pi plastic (polyimide) is a non-melting high temperature polymer. strength, dimensional stability, and creep resistance remain high even at temperatures above 260°c.
this volume chronicles the proceedings of the third international symposium on polyimides and other high temperature polymers: synthesis, characterization, and
explore how advanced polyimide (pi) materials are shaping the future with unmatched thermomechanical performances, electrical properties, the flame and chemical resistance, driving innovation in semiconductors, evs, consumer electronics and the aeros
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toray advanced composites specializes in multiple composite and carbon fiber materials and processes for the world's aerospace, space/satellite, high-performance automotive racing, high-end industrial, and athletic footwear markets.
arkema offers a wide range of polyimide films, varnishes, powder and stock shapes for high-performance applications in semiconductors, evs, consumer electronics and the aerospace industry. pi material provides unmatched thermomechanical performances,
polyimide is a type of polymer that is known for its excellent mechanical and thermal properties, as well as its good chemical resistance. polyimide is a high performance polymer that is used in a wide range of applications where its unique high temperature properties make it a suitable choice.
uncover the world of polyimide plastics, their diverse properties, and get valuable tips on choosing the most suitable option.
polyimide materials, as kapton®, are widely used for flexible electronics substrates or as insulators, thanks to their wide range of thermal stability as well as excellent dielectric and mechanical properties. however, there are limitations in their processability and employment in new technologies due to their low solubility and deep amber staining, resulting from charge transfer interactions established between polymer rigid chains. currently, researchers are focusing on designing resins with excellent thermal and chemical stability, transparent and colorless with a high processability in terms of viscosity and solubility. however, balancing among all those properties for this class of materials remains a big challenge today, as some of these properties seem to exclude others. in this episode, the focus will be on aliphatic anhydrides, which play a key role for the final polyimide’s properties enhancement. this will be explained by b.sc. sara greco, a chemist working on this topic (as part of her master's thesis) in the r&d department of valsynthese, a swiss cdmo specialized in hazardous chemistry.
polyimides are usually applied in liquid form and then thermally cured as a thin film or layer to achieve the desired properties. precise temperature uniformity is essential in order to avoid cracks in the polyimide layer and color variations. for a system specifically suited to curing polyimides, visit the yes-450pb series and yes-vertacure product pages.
three kinds of naphthalene-containing diamines with –h, –ch3 or –ch(ch3)2 substituents at the ortho-positions of the aniline ring including 4,4′-(naphthalen-1-ylmethylene)dianiline (ban-1), 4,4′-(naphthalen-1-ylmethylene)bis(2,6-dimethylaniline) (ban-2) and 4,4′-(naphthalen-1-ylmethylene)bis(2,6-diisopropylaniline)
polyimide specialty polymers are finding growing usage in applications such as high temperature, thermally stable insulators and dielectrics, coatings, adhesives, and high performance composites. to add to this already rich field of polyimide functions, we wish to review recent research from our laboratory which features the photoconductive and electrochemical behavior of polyimides, areas which have not as yet been widely explored. the first area of research, which illustrates polyimides as electrochemically active materials, is the recent work of s. mazur and s. reich. it deals with the specially controlled deposition of very thin silver layers, or certain other metal layers, into a polyimide film prepared from 4,4′-oxydianiline and pyromellitic dianhydride. this is achieved by coating the polyimide film, ∼10μm thick, onto a cathode. the cathode is placed in an electrolyte solution containing silver ion. a potential is applied between the solution and the cathode, resulting in the diffusion of silver ions towards the cathode. at steady state, when the flux of electrons (moving away from the cathode) equals that of the silver ions, a well defined, particulate, dense silver layer, ∼0.1μm thick, is deposited within the polyimide film. it is shown that the position and thickness of the metal layer as well as its geometrical shape can be controlled very precisely. the second area of research, photoconductivity in polyimides, is the work of s. c. freilich. it is found that addition of electron donors, such as dimethylaniline, to kapton® polyimide film results in an enhancement of the photocurrent generated by as much as five orders of magnitude when compared to the undoped polymer. the mechanism of the enhancement is shown to be the result of radiation absorption by a charge transfer complex formed between the added electron donor and the imide portion of the polymer backbone. excitation is followed by rapid and complete electron transfer from the donor to pyromellitimide to yield the radical anion of the polymer and the radical cation of the donor. these ion pairs are demonstrated to be the carriers of the photocurrent. they also undergo rapid back electron transfer, and the geminate recombination process is consistent with an onsager model analysis.
by jason spruell
open access peer-reviewed chapter
advanced materials white polyimides thermalbright® polyimide thermalbright® polyimide is a breakthrough high temperature, highly reflective, essentially opaque, white polyimide film. typical polyimides are orange colored and highly absorptive when filled with white pigments, but thermalbright is bright white in color and contains no silicones, acrylics or non-polyimide polymers. thermalbright is highly customizable and available in […]
polyimides (pis) represent a benchmark for high-performance polymers on the basis of a remarkable collection of valuable traits and accessible production pathways and therefore have incited serious attention from the ever-demanding medical field. ...
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2021 volume 4 issue 3
this paper reviews the development of new high-temperature polymeric materials applicable to plastic substrates in image display devices with a focus on our previous results. novel solution-processable colorless polyimides (pis) with ultra-low linear coefficients of thermal expansion (cte) are proposed in this paper. first, the principles of the coloration of pi films are briefly discussed, including the influence of the processing conditions on the film coloration, as well as the chemical and physical factors dominating the low cte characteristics of the resultant pi films to clarify the challenges in simultaneously achieving excellent optical transparency, a very high tg, a very low cte, and excellent film toughness. a possible approach of achieving these target properties is to use semi-cycloaliphatic pi systems consisting of linear chain structures. however, semi-cycloaliphatic pis obtained using cycloaliphatic diamines suffer various problems during precursor polymerization, cyclodehydration (imidization), and film preparation. in particular, when using trans-1,4-cyclohexanediamine (t-chda) as the cycloaliphatic diamine, a serious problem emerges: salt formation in the initial stages of the precursor polymerization, which terminates the polymerization in some cases or significantly extends the reaction period. the system derived from 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-bpda) and t-chda can be polymerized by a controlled heating method and leads to a pi film with relatively good properties, i.e., excellent light transmittance at 400 nm (t400 = ~80%), a high tg (>300 °c), and a very low cte (10 ppm·k−1). however, this pi film is somewhat brittle (the maximum elongation at break, εb max is about 10%). on the other hand, the combination of cycloaliphatic tetracarboxylic dianhydrides and aromatic diamines does not result in salt formation. the steric structures of cycloaliphatic tetracarboxylic dianhydrides significantly influence the polymerizability with aromatic diamines and the cte values of the resultant pi films. for three isomers of hydrogenated pyromellitic dianhydride, the steric structure effect on the polymerizability and the properties of the pi films is discussed. 1,2,3,4-cyclobutanetetracarboxylic dianhydride (cbda) is a very unusual cycloaliphatic tetracarboxylic dianhydride that is suitable for reducing the cte. for example, the pi system derived from cbda and 2,2′-bis(trifluoromethyl)benzidine (tfmb) yields a colorless pi film with a relatively low cte (21 ppm·k−1). however, this pi is insoluble in common organic solvents, which means that it is neither solution-processable nor compatible with the chemical imidization process; furthermore, the film is somewhat brittle (εb < 10%). in addition, the effect of the film preparation route on the film properties is shown to be significant. films prepared via chemical imidization always have higher optical transparency and lower cte values than those prepared via the conventional two-step process (i.e., precursor casting and successive thermal imidization). these results suggest that compatibility with the chemical imidization process is the key for achieving our goal. to dramatically improve the solubility in the cbda-based pi systems, a novel amide-containing aromatic diamine (ab-tfmb), which possesses the structural features of tfmb and 4,4′-diaminobenzanilide (daba), is proposed. the cbda(70);6fda(30)/ab-tfmb copolymer has an ultra-low cte (7.3 ppm·k−1), excellent optical transparency (t400 = 80.6%, yellowness index (yi) = 2.5, and haze = 1.5%), a very high tg (329 °c), sufficient ductility (εb max > 30%), and good solution-processability. therefore, this copolymer is a promising candidate for use as a novel coating-type plastic substrate material. this paper also discusses how the target properties can be achieved without the help of cycloaliphatic monomers. thus, elaborate molecular design allows the preparation of highly transparent and low-cte aromatic poly(amide imide) and poly(ester imide) systems.
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